Motor controller technology development trend
4.1 High security
Torque safety through: SBC+MCU monitoring architecture, high-voltage backup power supply, safety-related driver chip, comprehensive diagnosis of IGBT fault, independent safety shutdown path, resolver signal decoding of independent ADC channel, high-quality two-channel high-voltage sampling circuit, different quality Three-phase current Hall sensor is implemented.
4.2, high EMC rating
Now the second generation of products may be able to do class3, class4, and later EMC will do class5, requiring measures to be miniaturized and lower cost. EMC core breakthrough innovation is positioned: with better filtering solutions, lower cost EMC device costs meet high-level EMC requirements. If EMC requires class5, the volume ratio is less than 5% and the cost is less than 50RMB.
Development research content includes: "Electronic control + motor" system EMC solution, core device EMC characteristics research and solution, "Electronic control + motor" system EMC simulation platform.
4.3, high pressure
Mainly for passenger cars, the current voltage is generally around 300-400V, and may develop to high voltage in the future. Super fast charging and power demand increase are the internal driving forces for the high voltage of electric vehicles. If the charging voltage is increased from 400V to 800V, the charging time can be shortened by half. This piece must be upgraded, electric vehicles will become popular in the future, and high voltage is a trend of development. Corresponding to this trend, the design of inverters will move from 650V IGBT design to higher 750V and 1200V IGBT.
4.4, high power density
From the perspective of packaging, the trend of traditional easy-to-use modules to square bricks, ultra-thin shapes, and finally bare DBC/chip forms has evolved. The volume of the package will be miniaturized with the sub-assembly. In 2018 or in the future, it can reach 1/10 of the size of the 2013 volume.
From the chip dimension to the high efficiency and high operating junction temperature, such as E3 chip, the operating junction temperature is 150 ° C, the EDT2 chip junction temperature can be increased to 175 ° C, SIC silicon carbide chip junction temperature can exceed 175 ° C, if E2 The chip power loss is 1, and the latter two power losses are between 0.8 and 0.3 to 0.5, respectively. The use of SiC devices can significantly reduce switching losses, improve system efficiency, reduce dead time, and increase system output. From the overall consideration of the battery pack and controller, the total cost decreased by 5%, and the cruising range increased by 10% from the perspective of the whole vehicle. The overall efficiency can be improved by using SiC devices.
With the development of devices and the development of packaging technology, cost prediction will gradually decrease.
In terms of product dimensions, the controller for supplying hippocampus can achieve 18kW/L, and the power density of the second passenger car controller can be 26kW/L. The latest passenger car controller can do 35kW/L. In the future, SiC materials are expected to achieve a power density of 45 kW/L.
4.5, device integration and customization
Functionally safe, highly integrated:
Functional safety, higher frequency:
Drive isolation IC: functional safety, high integration:
Model capacitors have been highly customized, even integrating EMC in model capacitors. For example, the controller's EMC Y capacitor, a separate board, will be integrated into the future. This is the motor controller itself, and the future system is also moving towards integration.
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